The PCB editor supports the first class, components that are manufactured as discrete entities and then placed on an inner layer of the circuit board during fabrication/assembly. Combined with the ongoing improvements being achieved in fabrication processes and technologies, they can also lead to a reduction in the product size, and lower fabrication and board-level assembly costs.Įmbedding components places a number of unusual demands on each stage of the process from design to fabrication, to assembly, to testing and maintenance of the finished product.Įmbedded components can be divided into two classes: embedded discrete components, that is components that are manufactured as standard discrete components and then placed on an inner layer of the circuit board during fabrication/assembly and formed embedded components, components that are actually formed on the internal layers, during the board fabrication process. These improvements deliver smaller and more reliable products, supporting faster signal speeds and higher bandwidths. For example, embedding discrete components directly under an integrated circuit can result in shorter signal lengths, reduced resistance and parasitic inductance, leading to lower noise and EMI, and improved integrity of the circuit signals.
One technique that delivers both higher density and improved support for higher signal frequencies, is to embed components within the layers of the circuit structure.
The ever increasing demand for smaller and more integrated electronic products, combined with the higher frequencies of the signals within these devices, drives the ongoing research into better ways to fabricate and assemble a circuit. This process is well supported by circuit board assembly houses, which typically use automated pick and place machines to position each component, ready to be soldered onto the surface. The traditional approach to circuit board design has been to place the components on the top and bottom surfaces of the board.
0 kommentar(er)
